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朱文輝——中南大學(xué)機(jī)電工程學(xué)院教授

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專(zhuān)家信息：

朱文輝，博士，中*部“****”專(zhuān)家，中南大學(xué)機(jī)電工程學(xué)院教授、博士生導(dǎo)師，973項(xiàng)目首席科學(xué)家，國(guó)家科技重大專(zhuān)項(xiàng)02專(zhuān)項(xiàng)總體論證專(zhuān)家委員會(huì)專(zhuān)家，封測(cè)產(chǎn)業(yè)創(chuàng)新戰(zhàn)略聯(lián)盟咨詢(xún)委專(zhuān)家。

教育及工作經(jīng)歷：

1991/4 - 1995/1，國(guó)防科學(xué)技術(shù)大學(xué)，應(yīng)用物理，博士。

1986/9 - 1988/1，中國(guó)科學(xué)技術(shù)大學(xué)，近代力學(xué)，碩士。

1981/9 - 1986/7，中國(guó)科學(xué)技術(shù)大學(xué)，近代力學(xué)，學(xué)士。

1988-1991年：中國(guó)科學(xué)院/石油部滲流流體力學(xué)研究所助理工程師。

1995-1996年：中國(guó)科學(xué)技術(shù)大學(xué)博士后，九六年破格提升為副教授。

1997-1999年：新加坡高等計(jì)算研究院(IHPC) 高級(jí)研究工程師。

1999-2001年：受日本文部省邀請(qǐng)?jiān)谌毡敬筅娓⒋髮W(xué)任助理教授。

2001-2004年：英飛凌科技亞太有限公司（Infineon）一級(jí)高級(jí)工程師。

2004-2006年：Cookson Electronics Packaging Materials(新加坡) 資深科學(xué)家。

2006-2010年：新加坡聯(lián)合科技(UTAC)科技研發(fā)部資深經(jīng)理。

2010-2014年：天水華天科技有限公司總工程師；昆山西鈦微電子科技有限公司總經(jīng)理。

2014年-至今：中南大學(xué)機(jī)電工程學(xué)院教授、博士生導(dǎo)師；微系統(tǒng)制造科學(xué)與工程系主任。

學(xué)術(shù)兼職及社會(huì)任職：

1.中國(guó)封裝測(cè)試產(chǎn)業(yè)創(chuàng)新戰(zhàn)略聯(lián)盟咨詢(xún)委員會(huì)專(zhuān)家。

2.華進(jìn)半導(dǎo)體先導(dǎo)技術(shù)研發(fā)中心公司第一屆董事會(huì)董事（2012-至今）。

3.北京工業(yè)大學(xué)客座教授（2010-至今）。

4.上海北京大學(xué)微電子研究院兼職教授（2010-2012）。

5.《電子封裝工藝設(shè)備》（2012，化學(xué)工業(yè)出版社）編委。

6.《電子封裝技術(shù)與可靠性》（2012，化學(xué)工業(yè)出版社）編委。

7. 美國(guó)IEEE會(huì)員（2006-2011）和ASME會(huì)員（1999-2006）。

8. Materials Science, Materials Science letters, Packaging Reliability,International Journal of Impact Engineering等多個(gè)國(guó)際雜志的審稿人。

9.IEEE EPTC（新加坡）會(huì)議組委會(huì)主要成員（2006-2009）、論壇與培訓(xùn)課程主席（2008）、Simulation and Design技術(shù)分會(huì)主席（2006-2009）。

10.ICEPT（-HDP）國(guó)際會(huì)議技術(shù)委員會(huì)共同主席（2010-2013），WLP論壇主席（2010），TSV論壇主席（2011），Simulation and Design分會(huì)主席（2008-2010）。

11.作為主要成員參與行業(yè)三維系統(tǒng)集成的研討與戰(zhàn)略制定（2011）。

研究方向：

1.IC三維集成。

2.微電子封裝及可靠性。

3.微納制造。

承擔(dān)科研項(xiàng)目情況：

1.國(guó)家973 計(jì)劃“高性能LED 制造與裝備中的關(guān)鍵基礎(chǔ)問(wèn)題研究”第四課題：封裝裝備執(zhí)行系統(tǒng)的多參數(shù)耦合設(shè)計(jì)及高加速度復(fù)合運(yùn)動(dòng)生成（2011CB013104），2011－2015。

2. 國(guó)家自然科學(xué)基金面上項(xiàng)目：面向芯片智能固化過(guò)程的時(shí)空多模型監(jiān)控系統(tǒng)（51175519）, 2012-2015。

3. 國(guó)家自然科學(xué)基金面上項(xiàng)目：針對(duì)電子封裝中熱力過(guò)程的具有時(shí)空處理機(jī)能的三維模糊自調(diào)節(jié)控制系統(tǒng)（50775224），2007-2009。

4. 國(guó)家杰出青年科學(xué)基金(B)–香港澳門(mén)青年學(xué)者合作研究基金：微電子封裝中復(fù)雜分布式參數(shù)過(guò)程的智能集成建模和控制（50429501）, 2005-2008。

5. 國(guó)家重點(diǎn)基礎(chǔ)研究發(fā)展計(jì)劃（973計(jì)劃）制造與工程科學(xué)領(lǐng)域“20/14nm集成電路晶圓級(jí)三維集成制造的基礎(chǔ)研究”項(xiàng)目，項(xiàng)目中央財(cái)政經(jīng)費(fèi)預(yù)算3600萬(wàn)元，其中前兩年項(xiàng)目預(yù)算批復(fù)1665萬(wàn)元，2015年。

6.指導(dǎo)并組織了02專(zhuān)項(xiàng)“高密度倒裝封裝的快速M(fèi)PP平臺(tái)建設(shè)”項(xiàng)目申報(bào)及實(shí)施工作，推動(dòng)國(guó)內(nèi)高端FC基板材料的應(yīng)用。參與策劃和組織國(guó)家重大02專(zhuān)項(xiàng)子課題“MCP封裝技術(shù)研發(fā)與產(chǎn)業(yè)化”的實(shí)施。該課題已通過(guò)專(zhuān)項(xiàng)驗(yàn)收。

7.領(lǐng)導(dǎo)開(kāi)發(fā)了新一代TSV-CIS、3DTSV、FCCSP/BGA、高密度V/UQFN、FCQFN和AAQFN等系列技術(shù)并實(shí)現(xiàn)量產(chǎn)。

8.2010年就職華天科技公司后，組織封裝技術(shù)研究中心、設(shè)備部、財(cái)務(wù)部等相關(guān)人員申報(bào)了2010年02專(zhuān)項(xiàng) “多圈V/UQFN、FCQFN和AAQFN封裝工藝技術(shù)研發(fā)及產(chǎn)業(yè)化”項(xiàng)目。

9.2011年組織了“通訊與多媒體芯片封裝測(cè)試設(shè)備與材料應(yīng)用工程”申報(bào)，積極與專(zhuān)項(xiàng)辦和責(zé)任專(zhuān)家聯(lián)系溝通，協(xié)調(diào)解決申報(bào)中的問(wèn)題與困難，實(shí)現(xiàn)了項(xiàng)目的成功申報(bào)，并順利開(kāi)展了實(shí)施工作。

科研成果：

1.2010-2012年獲得國(guó)家重點(diǎn)新產(chǎn)品獎(jiǎng)2項(xiàng)、中國(guó)半導(dǎo)體創(chuàng)新產(chǎn)品和技術(shù)獎(jiǎng)3項(xiàng)、甘肅省年度優(yōu)秀新產(chǎn)品新技術(shù)獎(jiǎng)5項(xiàng)。2010-2012年申報(bào)天水市科技進(jìn)步獎(jiǎng)3項(xiàng)，均獲得天水市科技進(jìn)步一等獎(jiǎng)。

2.領(lǐng)導(dǎo)研究出具有自主知識(shí)產(chǎn)權(quán)的全新AAQFN產(chǎn)品，開(kāi)發(fā)了 V/UQFN, FCQFN等系列新產(chǎn)品，突破和掌握了引腳后蝕刻分離等技術(shù)，大大提高了QFN的封裝密度，將QFN I/O數(shù)提高到441L，建立了Flip Chip工藝能力，開(kāi)發(fā)出5種V/UQFN新產(chǎn)品、7種FCQFN新產(chǎn)品、3種AAQFN及3種FCBGA系列產(chǎn)品，申請(qǐng)專(zhuān)利68項(xiàng)，已授權(quán)30項(xiàng)，實(shí)現(xiàn)了高端技術(shù)先進(jìn)封裝的重大突破，為國(guó)內(nèi)相關(guān)高端芯片封裝提供了重要服務(wù)平臺(tái)。

3.立項(xiàng)研究的“陣列式鏡頭智能成像TSV-CIS集成模塊工藝研發(fā)與產(chǎn)業(yè)化”項(xiàng)目、“FC+WB三維混合集成封裝高壓技術(shù)研發(fā)與產(chǎn)業(yè)化”及“先進(jìn)QFN封裝設(shè)備與材料示范工程”等項(xiàng)目也都通過(guò)2013年國(guó)家科技部02重大專(zhuān)項(xiàng)的立項(xiàng)初審。

4.領(lǐng)導(dǎo)管理了一個(gè)國(guó)家認(rèn)定的企業(yè)技術(shù)中心，加強(qiáng)了華天科技現(xiàn)有可靠性實(shí)驗(yàn)室的建設(shè)，籌建了一個(gè)封裝表征與可靠性實(shí)驗(yàn)中心，設(shè)計(jì)與仿真分析平臺(tái)，推動(dòng)成立了中科華天西鈦先進(jìn)封裝聯(lián)合實(shí)驗(yàn)室。

5.開(kāi)辟了新的Flip chip產(chǎn)品方向，帶領(lǐng)研發(fā)具有自主知識(shí)產(chǎn)權(quán)的AAQFN系列產(chǎn)品，建立了Flip chip和蝕刻新工藝的研發(fā)工程線(xiàn)。

6.加強(qiáng)了企業(yè)設(shè)計(jì)與仿真分析平臺(tái)的建設(shè)，結(jié)合企業(yè)目前封裝現(xiàn)狀引入了HFSS、POWER SI、FLOTHERM+FLOPACK、UPD、ANSYS MECHANICAL、Molder3D等軟件，從各仿真軟件的引進(jìn)、配套平臺(tái)的建設(shè)、利用模型復(fù)現(xiàn)實(shí)際系統(tǒng)中發(fā)生的本質(zhì)過(guò)程，到軟件的完善升級(jí)、更新?lián)Q代，承擔(dān)了總體的規(guī)劃實(shí)施。通過(guò)三年的努力，在設(shè)計(jì)、封裝、測(cè)試、實(shí)驗(yàn)分析等方面建立了完善的設(shè)計(jì)與仿真分析能力，將仿真的技術(shù)應(yīng)用到微電子器件封裝設(shè)計(jì)中，改變了研發(fā)方法，縮短了研發(fā)周期，滿(mǎn)足了客戶(hù)需要，節(jié)省了研發(fā)成本，并為加工和生產(chǎn)過(guò)程中問(wèn)題提供了快速有效的新方案。

發(fā)明專(zhuān)利：

已授權(quán)專(zhuān)利

1 多圈排列無(wú)載體雙IC芯片封裝件中國(guó) 實(shí)用新型 ZL201120228061.5 2011.06.30

2 多圈排列IC芯片封裝件中國(guó) 實(shí)用新型 ZL201120228077.6 2011.06.30

3 多圈排列雙IC芯片封裝件中國(guó) 實(shí)用新型 ZL201120228063.4 2011.06.30

4 多圈排列無(wú)載體雙IC芯片封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 ZL201110181830.5 2011.06.30

5 多圈排列IC芯片封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 ZL201110181837.7 2011.06.30

6 一種基板的多層隔片式IC芯片堆疊封裝件中國(guó) 實(shí)用新型 ZL201120568213.6 2011.12.31

7 一種單載體MEMS器件封裝件中國(guó) 實(shí)用新型 ZL201120568239.0 2011.12.31

8 一種雙載體雙MEMS器件封裝件中國(guó) 實(shí)用新型 ZL201120568237.1 2011.12.31

9 一種雙層MEMS器件堆疊封裝件中國(guó) 實(shí)用新型 ZL201120568188.1 2011.12.31

10 中心布線(xiàn)雙圈排列單IC芯片封裝件中國(guó)實(shí)用新型 ZL201120568217.4 2011.12.31

11 一種中心布線(xiàn)雙圈排列IC芯片堆疊封裝件中國(guó) 實(shí)用新型ZL201120568212.1 2011.12.31

12 一種BT基板的懸梁式IC芯片堆疊封裝件中國(guó) 實(shí)用新型ZL201220141808.8 2012.04.06

13 四邊扁平無(wú)引腳封裝件中國(guó) 實(shí)用新型 ZL201220141710.2 2012.04.06

14 四邊扁平無(wú)引腳多圈排列IC芯片封裝件中國(guó) 實(shí)用新型 ZL201220250188.1 2012.05.30

15 一種引線(xiàn)框架的寶塔式IC芯片堆疊封裝件中國(guó) 實(shí)用新型 ZL201220439870.5 2012.08.31

尚未授權(quán)專(zhuān)利

1 一種球型光柵陣列IC芯片封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201010569804.5 2010.12.02

2 多圈排列無(wú)載體IC芯片封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110181828.8 2011.06.30

3 多圈排列雙IC芯片封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110181831.X 2011.06.30

4 中心布線(xiàn)雙圈排列單IC芯片封裝件及其制備方法中國(guó) 發(fā)明專(zhuān)利 201110454999.3 2011.12.31

5 一種雙層MEMS器件堆疊封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110455037.X 2011.12.31

6 一種中心布線(xiàn)雙圈排列IC芯片堆疊封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110455052.4 2011.12.31

7 一種雙載體雙MEMS器件封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110455053.9 2011.12.31

8 一種單載體雙MEMS器件封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110455054.3 2011.12.31

9 一種基板的多層隔片式IC芯片堆疊封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201110455062.8 2011.12.31

10 四邊扁平無(wú)引腳封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201210098828.6 2012.04.06

11 一種BT基板的懸梁式IC芯片堆疊封裝件及其生產(chǎn)方法中國(guó) 發(fā)明專(zhuān)利 201210098857.2 2012.04.06

12 四邊扁平無(wú)引腳多圈排列IC芯片封裝件生產(chǎn)方法及封裝件中國(guó) 發(fā)明專(zhuān)利 201210173671.9 2012.05.30

13 一種帶有方形凹槽的沖壓框架的扁平多芯片封裝件及其制作方法中國(guó) 發(fā)明專(zhuān)利 201210582792.9 2012.12.28

14 一種底填料固化后晶圓減薄的單芯片封裝件及其制作工藝中國(guó) 發(fā)明專(zhuān)利 201210582312.9 2012.12.28

15 一種Fan-out Panel Level BGA封裝件的制作工藝中國(guó) 發(fā)明專(zhuān)利 201210542559.8 2012.12.15

16 一種擴(kuò)展引腳的Fan-out Panel Level BGA封裝件及其制作工藝中國(guó) 發(fā)明專(zhuān)利 201210541846.7 2012.12.14

17 一種帶有銅柱的晶圓減薄的單芯片封裝件及其制作工藝中國(guó) 發(fā)明專(zhuān)利 201210534210.X 2012.12.12

18 一種基于先棕化后刷綠漆的扁平封裝件制作工藝中國(guó) 發(fā)明專(zhuān)利 201210527175.9 2012.12.10

19 一種基于磨屑塑封體的扁平封裝件制作工藝中國(guó) 發(fā)明專(zhuān)利 201210523271.6 2012.12.9

20 一種基于腐蝕塑封體的扁平封裝件制作工藝中國(guó) 發(fā)明專(zhuān)利 201210523294.7 2012.12.9

論文專(zhuān)著：

獲ICEPT優(yōu)秀論文獎(jiǎng)3次。發(fā)表論文100余篇，國(guó)際會(huì)議特邀報(bào)告10余次。

a) Book chapter

1. 秦飛,安彤,朱文輝,曹立強(qiáng),可靠性物理與工程（譯著）,科學(xué)出版社,2013.

2. W.H. Zhu*, M. Yoshida and S. Tanimura: “Tensile Fracture in Al acted by 300ps laser pulses” - Chapter 16 in Engineering Plasticity and Impact Dynamics - Proceedings of the International Symposium on Plasticity and Impact (ISPI 2001), Ed. L.C. Zhang, World Scientific Publishing Co. Pte. Ltd., 2001, pp.279-294.

b) Articles in Journals

3. QIN Fei, XIA Guofeng, GAO Cha, AN Tong, ZHU Wenhui, Design of Experiment Methodology for Thermal Fatigue Reliability of Multi-row QFN Packages Based on Numerical Simulations, Journal of Mechanical Engineering(2014):50(18).

4. Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu, Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method, ASME Journal of Electric Packaging, 2013, 135:0410071-0410076.

5. T.C. Chai, X. Zhang, H.Y. Li, V.N. Sekhar, W.Y. Hnin, M.L. Thew, O.K. Kanvas, John Lau,W.H. Zhu, Impact of packaging design on reliability of large die Cu-Low-k (BDTM) Interconnect, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 2, NO. 5, MAY 2012.

6. 夏國(guó)峰, 秦飛, 朱文輝, 馬曉波, 高察, LQFP和eLQFP熱機(jī)械可靠性的有限元分析, 半導(dǎo)體技術(shù).2012.37(7):552-557.

7. 秦飛, 王珺, 萬(wàn)里兮, 于大全, 朱文輝, TSV結(jié)構(gòu)熱機(jī)械可靠性研究綜述, 半導(dǎo)體技術(shù).2012.37(11):835-831.

8. F.X.CHE, W.H. ZHU, EDITH POH, X.W.ZHANG, T.C. CHAI, X.R.ZHANG, Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Doping, Journal of Electronic Materials 40.3 (Mar 2011): 344-354.

9. F.X. Che, W.H. Zhu, Edith Poh, X.W. Zhang , X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures, Journal of Alloys and Compounds507.1 (Sep 24, 2010): 215-224.

10. F.X. Che, W.H. Zhu, X.W. Zhang, T.C. Chong, Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods, IEEE Transactions on Device and Material Reliability (2008): 8(3), 455-463.

11. W.H.Zhu*, Sharry Ang, S. L. Gan, Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range, Journal of Materials Science(2005): 40(6), 1533-1537.

12. T.Y. Lin, M. Pecht, Diganta Das, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu, W.H. Zhu*, The Evaluation of Copper Migration during Die Attach Curing and Wire Bonding Process, IEEE Transactions on Components and Packaging Technologies (2005): 28(2), 377-344.

13. W.H. Zhu*, M.Yoshida, Spall strength of thin aluminum foils at ultra high strain rate, Journal of Materials Science Letters (2002): 21, 1569-1572.

14. W.H. Zhu*, M. Yoshida, H. Tamura, K. Kondo, S. Tanimura, Multiple spalling of aluminum subjected to a pico-second stress pulse, Journal of Materials Science Letters (2001): 20(10), 961-963.

15. W.H. Zhu*, M. Yoshida, H. Tamura, K. Kondo, S. Tanimura, Multiple spallation in aluminum induced by ultra-short stress pulses, Special issue of International Journal of Materials Processing Technology (2001): 117(3).

16. S. Tanimura, K. Mimura, W.H. Zhu*, A dynamic constitutive equation and its experimental verification, Journal de Physique IV (2000): 10 (Pr9), 33-38.

17. S. Tanimura, K. Mimura W.H. Zhu*, Practical constitutive models covering wide ranges of strain rates, strains and temperature, Key Engineering Materials (2000): 177-180, 189-200.

18. W.H. Zhu*, G. Shi, S. Tanimura, Effect of soft material on insulating impact pressure into explosive, Key Engineering Materials (2000): 177-180, 237-242.

19. W.H. Zhu*, T.X. Yu, Z.Y. Li, Laser induced shock waves in PMMA confined foils, International J. of Impact Engineering (2000): 24(6-7), 641-657.

20. S. Tanimura, K. Mimura, T. Nonaka, W.H. Zhu*, Dynamic Failure of structures due to the great Hashin-Awaji earthquake, International J. of Impact Engineering (2000): 24(6-7), 583-596.

21. W.H. Zhu*, H.L. Xue, G.Q. Zhou, G.K. Schleyer, Dynamic response of cylindrical explosive chambers to internal blast load produced by a concentrated explosive charge, International J. of Impact Engineering (1997): 19 (9), 831-845.

22. W.H. Zhu*, Z.Y. Li, G.Q. Zhou, Z.H. Liu, Effects of Black paints on laser-induce shock waves in confined targets, J. of High Power Lasers and Particle Beams (in Chinese) (1997): 9(3), 458-462.

23. W.H. Zhu*, Z.Y. Li, G.Q. Zhou, X.Z. Li, Measurement of laser-induced shock waves by PVDF, J. of Experimental Mechanics (in Chinese) (1997): 12(2), 216-220.

24. Z.Y. Li, W.H. Zhu*, J. Cheng, D.H. Guo, H. Wu, Experimental study of high-power pulsed laser induced shocks in aluminum targets, Chinese Journal of Lasers (1997): A24 (3): 259-262.

25. Z.Y. Li, W.H. Zhu*, D.H. Guo, H. Wu, Experimental study of the effect of PMMA confinement on laser shock waves, Chinese Journal of Lasers (1997): A24 (2): 118-122.

26. W.H. Zhu*, H.L. Xue, Z.Y. Zhang, Combining analytical method with numerical solution to obtain blast load on chamber wall produced by an explosive charge, J. of National University of Defense Technology (1997): 19(6), 102-106.

27. Z.Y. Li, W.H. Zhu*, J. Cheng, G.Q. Zhou, Measurement of Laser Induced Shock Waves in Carbon Epoxy Composites, J. Materials Science Letters(1996): 15, 2122-2123.

28. Z.Y. Li, W.H. Zhu*, J. Cheng, G.Q. Zhou D.H. Guo, Experimental study on attenuation of high power laser-induced shock waves in copper, Chinese Science Bulletin (1996) (English edition): 41(20), 1694-1696.

39. W.H. Zhu*, G.Q. Zhou, J. Cheng, Dependence of yield Stress on grain size of nanocrystals, Acta Metallurgical Sinica (1996): 32(9), 959-965.

30. Z.Y. Li, W.H. Zhu*, J. Cheng, G.Q. Zhou, Nondestructive estimation of homogeneity in materials using laser shocks, Applied Laser Technology (in Chinese) (1996): 16(4), 166-168.

31. W.H. Zhu*, Z.Y. Li, G.Q. Zhou, J. Cheng, Dynamic loading in materials using laser-induced shocks, Applied Laser Technology (in Chinese) (1996): 16(2), 52-54.

32. W.H. Zhu*, H.L. Xue, J. Han, G. Liu, On the study of dynamics of explosive chambers, Advances in Mechanics (in Chinese) (1996): 26(1), 68-77.

33. W.H. Zhu*, H.L. Xue, C. L. Liu, J. Han, Experimental study on the explosive chambers under internal blast load, Explosion and Shock Waves (in Chinese) (1995): 15(4), 374-381.

34. Z.Y. Zhang, S. Huan, F.Y. Lu, W.H. Zhu*, Viscoplastic collapse mechanism of hot-spot formation in porous TNT explosives, Energetic Materials (in Chinese) (1994): 2(2), 36-42.

35. W.H. Zhu*, S. Huan, Principal difficulties in dynamic experiments of composites, Ordnance Materials Science and Engineering (in Chinese) (1993): No.6, 51-58.

36. W.H. Zhu*, C. Q. Liu, Study of unsteady flow of non-Newtonian fluids in annular pipes, J. of National University of Defense Technology (in Chinese) (1993): No. l, 105-110.

37. W.H. Zhu*, S. Huan, Carbon/epoxy composites under impact tension, J. of Ballistics (in Chinese) (1993): No.3, 70-75.

38. W.H. Zhu*, C. Q. Liu, Analytical solution of flow of second-order non-Newtonian fluids through annular pipes, Chinese J. of Applied Mathematics and Mechanics (1993) (English edition): 14(3), 209-215.

39. W.H. Zhu*, C. Q. Liu, Analytical solution for the unsteady flow of Maxwell fluids through annular pipes, Acta Mechanica Sinica (in Chinese) (1992): 24(1), 116-121.

40. X.M. Liu, W.H. Zhu*, X.Z. Li, Study on the viscoelastic properties of wet bull-femur bone under high strain rates, J. of Biomechanics (in Chinese) (1991): 5(7), 1-8.

c). * Published contributions to academic conferences (partial list)

41. WU Wei, QIN Fei, ZHU Wenhui, Delamination Analysis and Reliability Design for CMOS Image Sensors Packages, 2013 International Conference on Electronic Packaging Technology & High Density Packaging, 2013, 507-511.

42. XIA Guofeng, QIN Fei, GAO Cha, AN Tong, ZHU Wenhui, Finite Element Based DOE Methodology for Thermal Fatigue Reliability Design of Multi-row QFN Packages, 2013 International Conference on Electronic Packaging Technology & High Density Packaging, 2013, 512-516.

43. 夏國(guó)峰，秦飛，高察，安彤，朱文輝，基于數(shù)值模擬的多圈QFN封裝熱疲勞可靠性試驗(yàn)方法，中國(guó)力學(xué)大會(huì)，2013.

44. Songfang Zhao, Guoping Zhang*, Chongnan Peng, Rong Sun*, S. W. Ricky Lee, Wenhui Zhu, Fangqi Lai. Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via. Electronic Components & Technology Conference (ECTC2013, Las Vegas) 81-85.

45. XIA Guofeng, QIN Fei, ZHU Wenhui, GAO Cha, MA Xiaobo, Interfacial Delamination and Reliability Design of Exposed Pad Packages, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 588-594.

46. XIA Guofeng, QIN Fei, ZHU Wenhui, GAO Cha, MA Xiaobo, Effects of Solder Constitutive Models and FE Models on Fatigue Life of Dual-raw QFN Package, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 595-599.

47. QIN Fei, ZHU Wenhui, GAO Cha, XIA Guofeng, MA Xiaobo, Optimal Thermal Design of a High Power Package Using the Design of Experiment(DOE), 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 611-615.

48. XIA Guofeng, QIN Fei, ZHU Wenhui, MA Xiaobo, GAO Cha, Comparative Analysis of Reliability between Dual-raw and Conventional QFN Packages, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 616-619.(Outstanding Paper Award)

49. WU Wei, XIA Guofeng, QIN Fei, ZHU Wenhui, MA Xiaobo, Thermal Fatigue Life Optimization of QFN Package Based on Taguchi Method, 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 1128-1132.

50. Siew Hoon Ore, W.H. Zhu, Dr W.L. Yuan, Dr Nathapong Suthiwongsunthorn，Module Level Thermal Performance Characterization and Enhancement of Chip Stack and Package Stack Memory Devices，EPTC2010, Singapore, 8-10 Dec. 2010, P. 626-631.

51. K.Y. Au, S.L. Kriangsak, X.R. Zhang, W.H. Zhu and C.H.Toh, 3D Chip Stacking & Reliability Using TSV-Micro C4 Solder Interconnection, 2010 Electronic Components and Technology Conference, P.1376-1384.

52. John Beleran, Tan Hua Hong, Ong PL Wilson, Dr Zhang XR, Gatbonton Librado Amurao, Gaurav Mehta & Dr Zhu WH, Solutions for 45/40nm ELK Device Integration into Flip Chip and Wire Bond Packaging, 2010 Electronic Components and Technology Conference, P.1604-1612.

53. Y. B. Yang, X. R. Zhang, W. H. Zhu, J. C. Teddy, Y. W. Liang, S. Nathapong, C. Surasit, Reliability Design for Exposed Pad and Low-profile Leadframe Package, ICEPT2010, Xi An, P.643-647 (Best Paper award, 獲最佳論文獎(jiǎng)).

54. Siew Hoon Ore, Edith Poh S W, Dr. W.H. Zhu, Dr W.L. Yuan, Dr Nathapong Suthiwongsunthorn, Co-Design for Thermal Performance and Mechanical Reliability of Flip Chip Devices, ICEPT2010, Xi An, P.81-87.

55. Siew Hoon Ore, Dr. W.H. Zhu, Dr W.L. Yuan, Dr Nathapong Suthiwongsunthorn A New Tool Development for the Thermal Design and Quick Performance Evaluation of FBGA Devices, ICEPT2010, Xi An, P.698-703.

56. X.R. Zhang, W.H. Zhu, B.P. Liew, M. Gaurav，etc，Copper Pillar Bump Structure Optimization for Flip Chip Packaging with Cu/Low-K Stack，EuroSime2010，Berlin， P.1-7.

57. Wei Sun, W.H. Zhu, Edith S. W. Poh, H.B. Tan and Richard Te Gan, Study of Five Substrate Pad Finishes for the Co-design of Solder Joint Reliability under Board-level Drop and Temperature Cycling Test Conditions, ICEPT –HDP 2008 (E3-08).

58. Wei Sun, W.H. Zhu, Kriangsak Sae Le and H.B. Tan, Simulation Study on the Warpage Behavior and Board-level Temperature Cycling Reliability of PoP Potentially for High-speed Memory Packaging, ICEPT –HDP 2008 (C3-05) (Best conference paper,最佳論文獎(jiǎng)).

59. T.C. Chai, D.Q. Yu, W.H. Zhu and X.R. Zhang, Angled high strain rate shear testing for SnAgCu solder ball, the 58th Electronic Components and Technology Conference (ECTC2008), 27-30 May 2008, Florida, US, P.623-28.

60. Chai TC, Xiaowu Zhang, H.Y. Li, VN Sekhar, Hnin WY, Thew ML, OK Navas, John Lau, R. Murthy, S. Balakumar ,Tan YM, Cheng CK, SL Liew, Chi DZ, Zhu W.H., Impact of Packaging Design on Reliability of Large Die Cu/low-κ (BD) Interconnect, the 58th Electronic Components and Technology Conference (ECTC2008), 27-30 May 2008, Florida, US, P.38-45.

61. W.H. Zhu, Luhua Xu, John HL Pang, X.R. Zhang, Edith Poh, Y.F. Sun, Anthony Y.S. Sun, C.K. Wang, H.B. Tan, Drop Reliability Study of BGA Assemblies with SAC305, SAC105 and SAC105-Ni Solder Ball on Cu-OSP and ENIG Surface Finish, the 58th Electronic Components and Technology Conference (ECTC2008), 27-30 May 2008, P.1667-72.

62. S. Krishna S., W.H. Zhu, C.K. Wang, S.H. Ore, H.B. tan and Anthony Y.S. Sun, Thermal performance evaluation and methodology for pyramid stack die packages, Proceedings of Itherm2008, 28-31 May 2008, Florida, US, P.325-32.

63. Edith S.W. Poh*, W.H. Zhu, X.R. Zhang, C.K. Wang, Anthony Y.S. Sun and H.B. Tan, Lead-free Solder Material Characterization For Themo-mechanical Modeling, Proceedings of EuroSime2008, 20-23 April, 2008, Freiburg, Germany, P.627-34.

64. Wei Sun, W.H. Zhu, C.K. Wang, Anthony Y.S. Sun and H.B. Tan, Warpage Simulation and DOE Analysis with Application in Package-on-Package Development, Proceedings of EuroSime2008, 20-23 April, 2008, Freiburg, Germany, P.244-51.

65. F.X. Che and W.H. Zhu, Reliability assessment for Cu/Low-k structure based on bump shear modeling and simulation method, EPTC2007, Singapore, 10-12 Dec. 2007, P. 27-31.

66. F.X. Che, Edith Candy Poh, W.H. Zhu and B.S. Xiong, Ag Content Effect on Mechanical Properties of Sn-xAg-0.5Cu Solders, EPTC2007, Singapore, 10-12 Dec. 2007, P. 713-718.

67. Krishnamoorthi. S, W.H. Zhu, C.K.Wang, H.B. Tan and Anthony Y.S. Sun, Thermal Evaluation of Two Die Stacked FBGA Packages, EPTC2007, Singapore, 10-12 Dec. 2007, P. 278-284.

68. Weiliang Yuan, Wenhui Zhu, Palei Win, CK Wang, HB Tan, and Anthony YS Sun, "Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages", Proceedings of 8th International Conference on Electronics Packaging Technology (ICEPT 2007), August 14th – 17th, 2007, Shanghai, China, pp.597-600.

69. Wei Sun, C.K. Wang, W.H. Zhu, F.X. Che, Anthony Y.S. Sun and H.B. Tan, Ultra-thin Die Characterization for Stack-die Packaging, ECTC2007, Rero, 29 May-1st June, 2007, pp. 1390 - 1396.

70. F. X. Che, W. H. Zhu, Wei Sun, Anthony Sun, C.K. Wang and H.B. Tan, Comprehensive Modeling Stress-Strain Behavior for Lead-Free Solder Joints under Board-Level Drop Impact Loading Condition, ECTC2007, Rero, 29 May-1st June, 2007, pp. 528-535.

71. F. X. Che, W. H. Zhu, Wei Sun, Anthony Sun and C.K. Wang, Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging, EuroSime2007, London, UK, 15-18 April, 2007, pp. 375 -381.

72. Wei Sun, W.H. Zhu, F.X. Che, C.K. Wang, Anthony Y.S. Sun and H.B. Tan, Study on the Board-level SMT Assembly and Solder Joint Reliability of different QFN Packages, EuroSime2007, London, UK, 15-18 April, 2007, pp 344-349.

73. W.H. Zhu, Sun Wei, Che F.X., Anthony Sun, C.K. Wang, H.B. Tan, Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement, EuroSime2007, London, UK, 15-18 April, 2007, pp. 579-586.

74. F.X. Che, W.H. Zhu, X.W. Zhang and T.C. Chong, Reliability Evaluation for Copper/Low-k Structures Based on Experimental and Numerical Methods, EPTC2006, Singapore, 10-12 Dec. 2007, pp. A2.3.

75. S. Krishna, W.H. Zhu, C.K. Wang, H.B. Tan and Y.S. A. Sun, Thermal evaluation of two-die stacked FBGA packages, EPTC2006, Singapore, 10-12 Dec. 2007, pp. A1.3.

76. F.X. Che, E.C. Poh, W.H. Zhu and B.S. Xiong, Ag content effect on mechanical properties of Sn-Xag-0.5Cu solders, EPTC2006, Singapore, 10-12 Dec. 2007, pp. G1.5.

77. F. X. Che, W. H. Zhu, Wei Sun, and Anthony Y. S. Sun, Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints, ICEPT2006, Shanghai China, 27-29, Aug. 2006, pp.155-160.

78. Wei Sun, W. H. Zhu, F. X. Che, C. K. Wang, Anthony Y.S. Sun and H. B. Tan, Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for Eutectic and Pb-free windows-Chip-Scale-Package (wCSP), ICEPT2006, Shanghai China, 26-29, Aug. 2006, pp.794-799 (Best conference paper, 獲最佳論文獎(jiǎng)).

79. F. X. Che, W. H. Zhu, Wei Sun, Anthony Sun and C.K. Wang, Application of Global-Local Modeling Technique in Electronic Packaging, 6th ASEAN ANSYS Conference, Singapore, 1-2 Nov, 2006 (no proceedings).

80. F.X. Che, W.H. Zhu and Anthony Y. S. Sun, Cyclic Bend Fatigue Reliability Investigation for Sn-Ag-Cu Solder Joints, EPTC2006, Singapore, 7-8 Dec. 2006, pp.313-317.

81. Wei Sun, W. H. Zhu, F. X. Che, C. K. Wang, Anthony Y.S. Sun and H. B. Tan, Experimental and Numerical Assessment of Board-level Temperature Cycling Performance for PBGA, FBGA and CSP, EPTC2006, Singapore, 7-8 Dec. 2006, pp.121-126.

82. Y.Y. Ma, Krishnamoorthi. S, C.K. Wang, Anthony Y.S. Sun, W.H. Zhu and H.B. Tan, On the Thermal Characterization of an Exposed Top Quad Flat No-Lead Package, EPTC2006, Singapore, 7-8 Dec. 2006, pp. 810-814.

83. W.L. Yuan, H.P. Kuah, C.K. Wang, Anthony Y.S. Sun, W.H. Zhu, H.B. Tan, and A.D. Muhamad, High-Speed Differential Interconnection Design for Flip-Chip BGA Packages, EPTC2006, Singapore, 7-8 Dec. 2006, pp. 76-81.

84. Gojun Hu, Andrew A. O. Tay, Yongwei Zhang, Wenhui Zhu and Spencer Chew, Characterization of Viscoelastic Behaviour of a Molding Compound with Application to delamination analysis in IC packages, EPTC2006, Singapore, 7-8 Dec. 2006, pp. 53-59.

85. Xueren Zhang, Tong Yan Tee, Hun Shen Ng, Jerome Teysseyre, Shane Loo, Subodh Mhaisalkar, Fong Kuan Ng, Chwee Teck Lim, Xinyu Du, Eric Bool, W.H.Zhu, Spencer Chew (2004), Hygro-thermo-mechanical Modeling of Mixed Flip-chip and Wire Bond tacked Die BGA Module with Molded Underfill. Proceedings of 2004 Electronic Packaging Technology Conference (EPTC2004), 10-12 Dec. 2004, Singapore (accepted).

86. T.Y.Lin, Diganta Das, Michael. Pecht and K.C.Teo, W.H. Zhu, X. Dong and G.H. Duan (2004), The Impact of SMD Post Baking Process on the Yield of Printed Circuit Board Assemblies. Proceedings of 2004 Electronic Packaging Technology Conference (EPTC2004), 10-12 Dec. 2004, Singapore (accepted).

87. W.H. Zhu, Sharry Ang, S. L. Gan and C.L. Toh (2004), Mechanical properties of molding compounds (MCs) under different moisture conditions and in a wide temperature range, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-systems, May 9-12, 2004, Belgium (accepted).

88. W.H. Zhu, S. Stephan, H. Pape and S. L. Gan (2003), Comparative study on solder joint reliability using different FE-models, Proceedings of 2003 Electronic Packaging Technology Conference (EPTC2003), 10-12 Dec. 2003, Singapore, P.687-694.

89. W.H. Zhu (2002), Stress design in a ball grid array (BGA) package, Proceedings of ANSYS User conference 2002, Nov. 2002, Singapore, P.1-12.

90. W.H. Zhu, Parametric characterization of warpage in electronic packaging. Proceedings of SEMICON Singapore 2002. 6-8 May 2002, Singapore, P.81-88.

91. S. Tanimura, T. Umeda, W.H. Zhu and K. Mimura, Evaluation of accuracy in measurement of dynamic load by using load sensing block method. Impact Engineering and Application (ELSEVIER) -Proceedings of the 4th International Symposium on Impact Engineering (ISIE/4), Ed. Akira Chiba, Shinji Tanimura and Kazuyuki Hokamoto, July 16-18, 2001, Kumamoto, Japan, Vol. 1, P.77-82.

92. W.H. Zhu, M. Yoshida, H. Tamura, K. Kondo and S. Tanimura: Multiple spallation in aluminum induced by ultra-short stress pulses, Abstract Proceedings of the International Conference on Processing and Manufacturing of Advanced Materials (THERMEC 2000), December 4-8, 2000, Las Vegas, USA, P.145 and THERMEC'2000 - Proceedings International Conference on Processing and Manufacturing of Advanced Materials, Las Vegas, USA, December 2000:CDROM, Section A2, Vol 117/3 “Special Issue: Journal of Materials Processing Technology, Eds. T.Chandra, K Higashi, C.Suryanarayana & C.Tome, Elsevier Science, UK (October 2001)”.

93. W.H. Zhu, S. Tanimura, K. Mimura and T. Umeda: Dynamic response of new sensing block systems and its applications to dynamic buckling tests, Proceedings of ICTAM2000 (International Congress on Theoretical and Applied Mechanics), August 27- September 2, 2000, Chicago, USA, p.69-GM07.

94. W.H. Zhu, M. Yoshida, H. Tamura, K. Kondo and S. Tanimura: Spall of aluminum induced by pico-second laser pulses. Proceedings of Symposium on Shock Wave Japan, Tokyo University, March 16-18, 2000, Tokyo, p.461-464.

95. S. Tanimura, K. Mimura, W.H. Zhu: A dynamic constitutive equation and its experimental verification. Proceedings of DYMAT2000- the 6th International Conference on Mechanical and Physical Behavior of Materials under Dynamic Loading, Krakow, Poland, September 25-29, 2000, Pr9-33~38.

96. S. Tanimura, K. Mimura, W.H. Zhu and T. Umeda: A practical rate sensitive constitutive equation applicable to wide range of strain rates and material groups. JSME 6th Symposium on Impact Problem of Materials, Kyoto, Japan, December 2-3, 1999.

97. S. Tanimura, K. Mimura, W.H. Zhu and T. Umeda: On high speed material testing and buckling testing systems by using sensing block method. JSME 6th Symposium on Impact Problem of Materials, Kyoto, Japan, December 2-3, 1999.

98. W.H. Zhu, K.Y. Lam, C. Lu and T.X. Yu: Experimental determination of laser induced shock pressures in PMMA confined copper foils. Impact Response of Material and Structures, - 3rd International Symposium on Impact Engineering (ISIE), Ed. By V.P.W. Shim, S. Tanimura and C.T. Lim (held in Singapore, 7-9 December 1998), Oxford University Press, 1999, p.280-285.

99. W.H. Zhu, T.X. Yu and K.Y. Lam: Folding of a fabric strip under its own weight. Proceedings of the High Performance Computing Conference, Vol. 1, 23-25 September 1998, Singapore, p.50-54.

100. S.C. Suresh, W.H. Zhu, H. Zheng, Z. Xu and et al: Finite element analysis of chain sprocket system. Proceedings of the High Performance Computing Conference, Vol. 1, 23-25 September 1998, Singapore, p.547-555.

101. *Z.Y. Li, W.H. Zhu, J. Cheng, G.Q. Zhou and D.H. Guo: Measurement of laser induced shock waves in aluminum targets using PVDF gauges. Proceedings of SPIE - The International Society for Optical Engineering v2888, 1996, p.232-236.(* This paper was cited by EI)

102. W.H. Zhu, Z.Y. Li, X.Z. Li and G.Q. Zhou: Experimental study on laser-induced shock in copper targets (abstract paper). Proceedings of International Congress on Theoretical and Applied Mechanics (ICTAM): Japan, August 1996, p.651.

103. W.H. Zhu and H.L. Xue: Simulation and analysis on the strain growth in vibration of explosive chambers (abstract paper). Proceedings of International Congress on Theoretical and Applied Mechanics (ICTAM), Japan, August 1996, p.649.

104. W.H. Zhu，Theoretical analysis on vibration of chamber structures under impulsive loading. Proceedings of 2nd International Symposium on Impact Engineering (ISIE), China, Ed. by C.Y. Chiem, L. L Wang and S. Tanimura, September 2-6, 1996, p.110-115.

105. W.H. Zhu, H.L. Xue and G.Q. Zhou: Analysis on vibration of cylindrical explosive chambers under internal blast loading. Proceedings of 4th National Conference on the Explosive Mechanics (in Chinese) China, October 1995, p.100.

106. W.H. Zhu and H.L. Xue: Experimental study on the vibration of explosive chambers. Proceedings of 4th National Congress on Impact Dynamics (in Chinese) China, October 1994, p.66-72.

107. X.M. Liu, X.Z. Li, and W.H. Zhu: Experimental study of wet bull-femur bones at high strain rates. Proceedings of International Conference on Constitutive Laws of Engineering Materials (ICCLEM), China, October 1989, p.392- 395.

d). Technical Reports

108. W.H. Zhu, Moisture effect on mechanical properties of molding compound. Internal Technical Report of Infineon Technologies, March 2004, p.1-65.

109. W.H. Zhu, Correlation of solder joint reliability between simulation and TCOB test, Internal Technical Report of Infineon Technologies, March 2004, p. 1-102.

110. W.H. Zhu and G. Shi, Evaluation of pressure contours induced by high explosive in storage chamber. Report No. CAE/99-17/CC, Institute of High Performance Computing, Singapore, May 1999, p.1-35.

111. W.H. Zhu, G. Shi, Addie Van Der Vegte and C. Lu, Survivability and penetration simulations of blast fragment warhead, Report No: CAE/9802/CC, Institute of High Performance Computing, Singapore, November, 1998, p.1-41.

112. H. Zheng, W.H. Zhu, S.C. Suresh and Z. Xu, Application of computational mechanics techniques for acoustic analysis of a chain/sprocket system, (Vols.1 and 2) Report No.9801, Institute of High Performance Computing, Singapore, 1998.

113. W.H. Zhu and T.X. Yu, Draping and folding of a fabric strip under its own weight. Report No. RI95/96.EG18—TR.01, Department of Mechanical Engineering, Hong Kong University of Science and Technology, October 1997, p.1-36.

*Note: Conference paper list is incomplete since it collected mainly those papers for international conferences. Most of the national conference papers including those for 863 high technology topic conference on laser weapon effects and etc. are not cited here.

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